Semiconductor-level micro-feeding technology, precision jig design, vision correction picking, vision correction placement, placement force control, timing control, laser measurement and control, precision XYZ and angle compensation, component detection, etc., can ensure the accuracy, speed, quality and repeatability of mounting semiconductor chips.
Precision dispensing pressure, micro-dispensing amount control, repeatability control, special dispensing control adapted to high viscosity, and post-dispensing detection need to ensure the accuracy, quality, speed, and repeatability of dispensing.
