This system is used in semiconductor packaging factories to replace manual work in the IC and other semiconductor packaging and plastic sealing processes, and the entire process is automated;
The system includes:
1) An all-in-one machine that automatically arranges chips and places rubber pellets, automatically places IC substrates into the jig, inspects and repairs them, checks the rubber pellets, and puts them into the jig;
2) The robot system performs foreign matter inspection and cleaning on the furnace fixture. The robot puts the IC substrate fixture into the plastic sealing fixture, puts the rubber particles in, takes out the finished product, and sends the finished substrate to the stamping machine for slitting and collection integration.
Features are as follows:
1) The layout occupies the least space, and the film and rubber particles are placed in one unit. The main unit is removable, making it easy to replace the cranial cavity fixture. It will automatically correct after restoration to adapt to different equipment layout requirements of customers;
2) All pick-up and placement (film placement, rubber pellet placement, jig placement, punching machine placement, etc.) are corrected by machine vision alignment. Check the placement status after placement. If placement is not good, it will be automatically corrected;
3) The use of assistance robots can safely allow people to enter the system, such as cleaning and repairing problems that the system cannot handle;
4) The independent system AI vision detects foreign objects in furnace cavity fixtures, automatically cleans them, and works simultaneously with the robot pick-and-place system to increase production capacity and shorten CT;
5) Central control provides full-process monitoring, report statistics, and connection to the management system;
6) Every detail is equipped with anti-fools to minimize various faults and automatically repair faults;
Layout and inspection Put rubber particles
Visual foreign object inspection and cleaning in the furnace
Visual furnace IC plastic packaging fixture
