Provide desktop automatic 3D solder paste thickness measuring machine or cost-effective manual soldering paste thickness measuring machine
Waltrontech Walscan fully automatic 3D solder paste thickness measuring machine
3D solder paste thickness measuring machine Alias: 3D three-dimensional solder paste measurement system
Features:
★ 3D scanning measurement
★ 3D simulation reconstruction
★ PCB multi-area programming scan
★ Automated, repeatable measurements
★ X, Y large scanning range
★ Z-axis servo, software correction
★ Automatic plate bending compensation
★ Five-speed multiple adjustment
★ Powerful SPC function
★ Product and production line management
★ Automatic analysis and extraction of solder paste
★ Humanized operation
★Precision laser line, displacement measurement principle.
★Comprehensive understanding of solder paste shape rules.
★Use 3D scanning to obtain overall data
Application scope:
★Solder paste thickness&Shape measurement
★Chip bonding, part co-planarity, BGA/CSP size and shape measurement
★Steel mesh&Measurement of size and shape of through holes
★PCB pad, pattern, silk screen thickness and shape measurement
★IC packaging, empty PCB deformation test
★Other 3D measurement, inspection and analysis solutions
Specifications
work platform | Maximum measurable PCB: 390×300mm | Measurement mode | Single point height measurement |
Average height measurement within the marquee | |||
XY scanning range: 390×300mm | 3D field of view automatic height measurement | ||
Work platforms of other sizes can be customized | Programmable, multi-zone 3D automatic height measurement | ||
Programmable, planar geometry measurement | |||
Measurement light source | Precision red laser line, height adjustable | 3D mode | 3D simulation diagram |
lighting source | High-bright white LED light ring, height adjustable | SPC model | X-Bar ＆R cart |
XY scanning room | 10um-50uM, configurable | Histogram analysis Ca/Cp/Cpk/Pp/Ppk | |
Scan speed | 60FPS | Data analysis, full SPC functionality | |
Scan range | Any setting, maximum 390×300mm | Data export, preview, printing, etc. | |
XY movement speed | Adjustable, maximum 35mm/s | Products, production lines, data analysis, management | |
height resolution | Maximum 1um | Other functions | Z-axis plate bending automatic compensation |
Repeatable measurement accuracy | ±2um | Software board bend compensation | |
Lens magnification | 20X-110X, 5 levels adjustable | Measuring products, production line management | |
Measure data density | 1.3 million pixels/1680*1024 | Parameter correction, password protection | |
Z-axis plate bending compensation | 10mm | marquee memory | |
Working power supply | 110V，60Hz/220V，50Hz AC | PC and operating system | Dual-core high-speed CPU + independent graphics card |
Windows XP | |||
Equipment size | 870×650×450mm | Equipment weight | 55KG |
automatic function | Programmable, automatic repeatable measurements | Indicators and buttons | Red, yellow and green indicator lights |
1 key to set position | emergency stop start | ||
Automatic measurement | Alarm buzzer |
