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The brazing process and the precision assembly and mounting machines used in it

Date:2026-02-13   Views:1795

The brazing process and the precision assembly and mounting machines used in it


Brazing is a welding process that uses a filler metal (brazing material) with a lower melting point than the base metal to fill the joint gap through capillary action when heated to a temperature above its melting point but lower than the melting point of the base metal, thereby achieving connection. Because of its high joint strength, small deformation, and ability to connect dissimilar materials, it is widely used in many industries. The following are common applicable products and application areas for the brazing process:

1. Heat exchangers and refrigeration equipment

Car radiator, air conditioning condenser, evaporator

Piping systems for household/commercial refrigerators and freezers

Copper-aluminum or copper-copper joints in HVAC systems

2. Electronic and electrical components

Baseboard connection of power modules and IGBT modules

Electrical connectors, relays, switch components

Precision connections in RF devices and microwave components

3. Aerospace and Defense

Jet engine blade cooling channel structure

Fuel system pipelines, hydraulic system components

High temperature alloy structural parts (such as nickel-based, cobalt-based alloys)


Specific to precision component assembly, especially electronic and partial semiconductor devices, the assembly machine requires the following:


  1. For precision soldering pads, because they are light, hollow, and slender (such as precision lead frames), the mounting platform needs to be stable to prevent vibration;

  2. Material supply requires multiple sets of vision to assist in stable material picking;

  3. Since multiple groups of components are stacked together without adhesive bonding, low vibration transmission is required;

  4. Special vacuum control, semiconductor-like level; targeted mounting parameters;

  5. Multiple visual alignment to ensure correct placement;

  6. Various matching feeding methods;


In short, it is the principle of a chip mounter, but it needs to be optimized according to the specific process characteristics to ensure that the components are stacked correctly before being soldered in the soldering furnace, thereby improving yield and productivity. 


It has been used stably in many industry leaders and military research institutes. We look forward to further cooperation and exchanges with various customers, research institutes, universities, brazing furnace manufacturers, and industry partners.

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