AI AOI
AI appearance inspection of chip dies, ICs, components, and micro sensors
AI Optical Inspection for IC, Wafer, Micro Module and Components
To replace the current manual automated inspection, it is mainly the optical appearance inspection of micro parts such as IC chips, wafers, components, etc.
Using a precision-controlled platform and a precision optical system, the parts are photographed, and then an algorithm is used to inspect the optical appearance of the parts. A list of NG parts is output for manual review.
The applied algorithms include: image cropping, preprocessing, template analysis, OCR, pixel measurement and other traditional machine vision inspection technologies, as well as AI, deep learning and Deep Learning visual inspection technologies for inspection. Link AI, artificial intelligence, deep learning AI can solve defect detection that was previously difficult to clearly define and had fuzzy standards.
The detection range includes: scratches, offsets, deformations, missing, blurred, damaged and other defects. Please send specific requests to discuss specific test algorithms and solutions.
